Polyester canvas card

ABSTRACT

Disclosed embodiments generally relate to a transaction card having a substrate component with a first substrate surface opposite a second substrate surface; a fabric component having a first fabric surface opposite a second fabric surface, the fabric and substrate being joined along the second fabric surface and the first substrate surface, the fabric component defining one or more apertures; and one or more electronic components disposed in the one or more apertures, the one or more electronic components and substrate being joined along a first electronic component surface and the first substrate surface.

TECHNICAL FIELD

The disclosed embodiments generally relate to transaction cardconstructions. More particularly, and without limitation, the disclosedembodiments relate to a transaction card having a writeable fabricsurface.

BACKGROUND

Transaction cards, such as credit and debit cards, have become a primarymeans for individuals to complete transactions involving data exchange.Traditional transaction cards are formed of plastic material as a singlepiece. For example, a typical credit card may be manufactured out of PVCplastic using an injection molding process. The plastic card may then bemodified to add functional and/or visual features. For example, amagnetic strip may be affixed to one side, the card may be stamped withthe card number and customer name, and color or a design may be addedfor appearance. Some plastic cards may also be formed of several layersof plastic using a lamination process.

Some transaction cards may also include advanced data storage componentsattached to or embedded within the card. For example, some transactioncards may include microchips (e.g., EMV chips) that more securely andefficiently manage card and customer information and/or near fieldcommunication (NFC) components that can wirelessly communicate withoutside devices (e.g., a point of sale device, mobile device, etc.).While these types of technology provide several advantages to customers,the conventional, one-piece transaction card and associated methods ofconstruction may not be ideal and could likely benefit significantlyfrom improvements.

In addition, as transaction cards increase in prevalence, expectationsfor transaction card quality have increased. Moreover, current trendsand advances in technology and social media have created demand forunique and customizable products. Many consumers and influencers chooseproducts and services that match their personal brand or that allow theflexibility to customize a product to fit their personal brand. However,traditional custom transaction cards may allow a user to upload an imageor select from a menu of stock images to be printed on a card, but donot give the customer full, creative flexibility to easily design atransaction card. Also, transaction cards have increasingly been made tomeet higher standards regarding materials, durability, security, andappearance, but have limited ability for user customization.

The present disclosure is directed to improvements in transaction cardsand methods of manufacture thereof.

SUMMARY

The disclosed embodiments relate to a transaction card and aprocess/method for constructing the card, wherein the card includes awriteable fabric surface.

According to a disclosed embodiment, a transaction card, may include: asubstrate component having a first substrate surface opposite a secondsubstrate surface; a fabric component having a first fabric surfaceopposite a second fabric surface, the fabric and substrate componentsbeing joined along the second fabric surface and the first substratesurface, the fabric component defining an aperture; and an electroniccomponent disposed in the aperture, the electronic component andsubstrate being joined along a first electronic component surface andthe first substrate surface.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory onlyand are not restrictive of the disclosed embodiments, as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate disclosed embodiments and,together with the description, serve to explain the disclosedembodiments.

FIG. 1 is a block diagram of an exemplary transaction system, consistentwith disclosed embodiments.

FIG. 2 is an exploded-view illustration of an exemplary transactioncard, consistent with disclosed embodiments.

FIG. 3A is a top view of an exemplary transaction card consistent withdisclosed embodiments.

FIG. 3B is a bottom view of the exemplary transaction card of FIG. 3A.

FIG. 4A is a top view of an exemplary transaction card consistent withdisclosed embodiments.

FIG. 4B is a bottom view of the exemplary transaction card of FIG. 4A.

FIG. 4C is a cross-sectional view of the exemplary transaction card ofFIG. 4A taken along line 4C-4C.

FIG. 5 is a flow chart of exemplary method/process steps of forming atransaction card consistent with disclosed embodiments.

FIG. 6A shows a first step of manufacturing an exemplary transactioncard consistent with disclosed embodiments.

FIG. 6B shows a second step of manufacturing an exemplary transactioncard consistent with disclosed embodiments.

FIG. 6C shows a third step of manufacturing an exemplary transactioncard consistent with disclosed embodiments.

FIG. 6D shows a fourth step of manufacturing an exemplary transactioncard consistent with disclosed embodiments.

FIG. 6E shows a fifth step of manufacturing an exemplary transactioncard consistent with disclosed embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to the disclosed embodiments,examples of which are illustrated in the accompanying drawings. Whereverconvenient, the same reference numbers will be used throughout thedrawings to refer to the same or like parts.

Disclosed embodiments include a transaction card with a writeable fabricsurface. The writeable surface may comprise a fabric material, e.g.,canvas. Disclosed embodiments further include a transaction card havingtwo or more separate card components that may be connectable to form thetransaction card. Various methods may be used to manufacture theseparate card components out of different types of materials that aresuitable for satisfying certain criteria or preferences. In addition,the construction of the separate components may allow for ease ofassembly, as well as interchangeability of the components.

The term “transaction card,” as used herein, may refer to a physicalcard product that is provided with features to receive, store, and/ortransmit transaction information. Examples of transaction cards mayinclude credit cards, debit cards, gift cards, rewards cards, frequentflyer cards, merchant-specific cards, discount cards, identificationcards, membership cards, and driver's licenses, but are not limitedthereto.

As used herein, the term “personal information” may include informationthat is associated with a user of the card or information associatedwith an account of/for the card user. For example, personal informationmay include “transaction information,” such as financial information(e.g., card numbers, account numbers, expiration dates etc.),quasi-financial information (e.g., rewards balance, discountinformation, etc.), individual-identifying information (e.g., name,address, etc.), bank information, and/or transaction networkinformation.

The physical properties of the transaction card (e.g., size,flexibility, location of various components included in the card) maymeet various international standards, including, for example, ISO/IEC7810, ISO/IEC 7811, ISO/IEC 7812, ISO/IEC 7813, ISO/IEC 7816, ISO 8583,ISO/IEC 4909, and ISO/IEC 14443. For example, a transaction card mayhave a dimension of 85.60 mm (width) by 53.98 mm (height) by 0.76 mm(thickness), as specified in ISO/IEC 7810.

FIG. 1 illustrates an exemplary transaction system 100. Transactionsystem 100 may be a computing system configured to receive and sendinformation between the components of transaction system 100 and/or withcomponents outside of system 100. Transaction system 100 may include afinancial service provider system 102 and a merchant system 104, whichmay be connected by a network 106. It should be understood, however,that transaction system 100 may include additional and/or alternativecomponents.

Financial service provider system 102 may be one or more computersystems associated with an entity that provides financial services. Forexample, the entity may be a bank, credit union, credit card issuer, orother type of financial service entity that generates, provides,manages, and/or maintains financial service accounts for one or morecustomers. Financial service accounts may include, for example, creditcard accounts, checking accounts, savings accounts, loan accounts,reward accounts, and any other types of financial service account.Financial service accounts may be associated with physical financialservice transaction cards, such as a credit or debit cards that a usermay carry on their person and use to perform financial servicetransactions, such as purchasing goods and/or services at a point ofsale (POS) terminal. Financial service accounts may also be associatedwith electronic financial products and services, such as a digitalwallet or similar account that may be used to perform electronictransactions, such as purchasing goods and/or services online.

Merchant system 104 may be one or more computer systems associated witha merchant. For example, merchant system 104 may be associated with anentity that provides goods and/or services (e.g., a retail store). Themerchant may include brick-and-mortar location(s) that a customer mayphysically visit and purchase goods and services. Such physicallocations may include computing devices (e.g., merchant system 14) thatperform financial service transactions with customers (e.g., POSterminal(s), kiosks, etc.). Additionally or alternatively, merchantsystem 104 may be associated with a merchant who provides electronicshopping mechanisms, such as a website or a similar online location thatconsumers may access using a computer through browser software, a mobileapplication, or similar software. Merchant system 104 may include aclient device, such as a laptop computer, desktop computer, smart phone,kiosk, or tablet that a customer may operate to access the electronicshopping mechanism.

Network 106 may be any type of network that facilitates communicationsand data transfer between components of transaction system 100, such as,for example, financial service provider system 102 and merchant system104. Network 106 may include but is not limited to a Local Area Network(LAN), a Wide Area Network (WAN), such as the Internet, and may be asingle network or a combination of networks. Network 106 is not limitedto the above examples, and transaction system 100 may implement any typeof network that allows the entities (shown and not shown) of transactionsystem 100 to exchange data and information.

Transaction system 100 may be configured to conduct a transactionassociated with the use of a transaction card 108. In one example,financial service provider system 102 may provide transaction card 108to a customer for use in conducting transactions associated with afinancial service account held by the customer. In an example of onesuch transaction, the customer may use transaction card 108 at amerchant location to make a purchase. During the course of the purchase,information may be transferred from transaction card 108 to merchantsystem 104 (e.g., a point of sale device). Merchant system 104 maycommunicate with financial service provider system 102 via network 106to complete the transaction. For example, merchant system 104 mayreceive account information from transaction card 108. Merchant system104 may transmit the account information and a purchase amount, amongother transaction information, to financial service provider system 102.Financial service provider system 102 may settle the transaction bytransferring funds from the customer's financial service account to afinancial service account associated with the merchant.

For example, in some embodiments, transaction card 108 may include adata storage component 110. As used herein, a “data storage component”may consist of or include one or more devices configured to receive,store, process, provide, transfer, send, delete, and/or generate data orother information. For example, data storage component 110 may include amicrochip (e.g., EMV chip), a communication device (e.g., Near FieldCommunication (NFC) antenna, radiofrequency identification (RFID)device, Bluetooth® device, WiFi device), a magnetic strip, a barcode, aQuick Response (QR) code, and/or other devices. Data storage device 110may be configured to store information in a computer-readable format.For example, data storage device may be configured to store informationin a format that can be read by merchant system 104, transmitted overnetwork 106, and read or processed by financial service provider system102.

While transaction system 100 and transaction card 108 are depicted anddescribed in relation to transactions that involve customers, merchants,and financial service providers, it should be understood that theseentities are used only as an example to illustrate one environment inwhich transaction card 108 may be used. It should be understood thattransaction card 108 is not limited to financial products and may be anyphysical card product that is configured to receive, store, and/ortransmit information. For example, transaction card 108 may be anidentification card configured to provide information for identifyingthe holder of the card (e.g., driver's license).

Referring to FIG. 2, in an exemplary embodiment, a transaction card 200(which may be, for example, transaction card 108) may include asubstrate component (“substrate”) 202, an adhesive material 204, anelectronic component 206, e.g., a microchip or data storage component,and a fabric component 208.

Substrate 202 may have a first substrate surface 212 and a secondsubstrate surface 210. Second substrate surface 210 may be visible froma second side 214 of card 200 and, as described below, may includevisible information (e.g., personal information).

Substrate 202 may be a bottom outward-facing component of card 200.Substrate 202 may be formed of multiple separate components or as aunitary structure. For example, substrate 202 may be formed usingmolding process, such as an injection molding, compression molding, orother type of molding process. Substrate 202 may be formed of, forexample, polycarbonate (PC), polyvinyl chloride (PVC), or a resinmixture configured to impart additional or desired properties onsubstrate 202. For example, substrate 202 may be formed of a resinmixture comprising one or more of a thermoplastic elastomer (TPE),polybutylene terephthalate (PBT), an acetal homopolymer, and/or othermaterials. In some embodiments, the TPE and/or other materials may beselected to provide card 200 with a “soft-touch feel” (i.e., a hapticsensation that occurs when a person touches something that, for example,feels soft, smooth, and/or satiny). In some embodiments, the resinmixture may include a polyester elastomer, a block copolymer, athermoplastic olefin, an elastomeric alloy, a thermoplasticpolyurethane, a thermoplastic copolyester, or a thermoplastic polyamide.In some embodiments, substrate 202 may be non-opaque (e.g., translucent,transparent, clear, etc.) after manufacturing is complete (e.g., aftersetting).

Adhesive material 204 may be disposed between substrate 202 and fabriccomponent 208 and configured to bond surface 212 of substrate 202 tosurface 218 of fabric component 208. Adhesive material 204 may be athermoplastic, polymer, or glue disposed between substrate 202 andfabric 208 in a layer. In some embodiments, adhesive material 204 mayjoin electronic component 206, disposed in aperture 222, to surface 212of the substrate 202. In other embodiments, a different adhesivematerial from adhesive material 204 may secure electronic component 206to surface 212. In some embodiment, polyvinyl chloride may be disposedbetween surface 212 and electronic component 206.

Electronic component 206 may be a microchip (e.g., an EMV chip). In someembodiments, transaction card 200 may include a communication device,e.g., an NFC or RFID device, disposed between substrate 202 and fabriccomponent 208. In other embodiments, transaction card 200 may beconfigured to at least partially include other or additional types ofdata storage components and/or other card components and is not limitedto those mentioned above.

In other embodiments, electronic components, in addition to, or insteadof electronic component 206, may be disposed between substrate 202 andfabric component 208. For example, an antenna or RFID component may beaffixed to either first substrate surface 212 or second fabric surface218 prior to joining substrate 202 and fabric component 208. In anotherexample, an electronic component may be disposed on adhesive layer 204prior to joining substrate 202 and fabric component 208.

Fabric component 208 may have a first fabric surface 216 and a secondfabric surface 218. First fabric surface 216 may be visible from a firstside 220. Substrate 202 and fabric component 208 may be joined byadhesive material 204 disposed between first substrate surface 212 andsecond fabric surface 218. In some embodiments, substrate 202 and fabriccomponent 208 may be joined without adhesive, by for example, alamination process. In some embodiments, substrate 202 and fabriccomponent 208 may be joined using a thermoplastic material disposedbetween first substrate surface 212 and second fabric surface 218.

As will be described in further detail below, fabric component 208 maybe a top outward-facing component of card 200. In some embodiments,fabric component 208 may include a woven fabric material, which may bevisible from first side 220 or second side 214 of card 200. Fabriccomponent 208 may be a canvas material or other heavy cotton fabric.Fabric component 208 may be a material capable of receiving inkdeposited by a writing tool, for example, a permanent marker, felt-tipmarker, fabric marker, paint marker, felt-tip pen, etc. Fabric component208 may be washable. For example, fabric component 208 may be configuredto receive ink and to subsequently be wiped clean with water or withsoap and water.

The fabric material of fabric component 208 may be chosen to achievedesired stiffness, strength, and/or other measures of durability. Inorder to achieve these desired characteristics, parameters of the fabricmaterial may be varied. For example, the fabric material may be woven,knit, or nonwoven, may be constructed with different weaving patterns,may use different yarn weights, may contain different fabric finishes orcoatings, fiber compositions including natural and/or synthetic fibers,and may contain varying thread counts.

In some embodiments, the fabric material may be a woven fabricconstructed using a specific weaving pattern. For example, the fabricmaterial may be constructed using, for example, any of the followingweaving patterns: plain (or alternating), basket, satin, sateen, twill,ripstop, or jacquard. By constructing the fabric material usingdifferent weaving patterns, the fabric material may have differentmechanical properties. For example, a fabric component 208 constructedusing a plain weave may provide additional fabric stability. In otherembodiments, a fabric component 208 constructed using a ripstop weavewith a crosshatch pattern containing reinforcement threads may be moreresistant to ripping or tearing.

In some embodiments, the type of weaving pattern used to construct thefabric material may enhance other desired characteristics for the fabricmaterial, such as water, stain, or abrasion resistance. For example, insome embodiments, additional abrasion resistance may be gained where theweaving pattern used to construct the fabric material includes longerfloats in the weaving pattern. In some embodiments, the density of theweaving pattern (i.e., the number of threads in a given amount of space)used to construct the fabric material of fabric component 208 may createa fabric material with limited or no porosity in order to enhance waterand stain resistance.

In some embodiments, the fabric material may be constructed using yarnsof a specific weight. For example, in some embodiments, a fabriccomponent 208 constructed using a fabric with higher weight will producea sturdier fabric. In some embodiments, the fabric material may containa specific thread count to obtain desired characteristics. The threadcount may be calculated by counting the total number of warp ends (alongthe length) and weft ends (along the width) in two adjacent edges of aone-inch square of the fabric. For example, in some embodiments, a highthread count fabric may be used to construct the fabric material offabric component 208 in order to obtain a more durable fabric.

In some embodiments, the fabric material may be formed of hydrophyllicfibers such that the fabric material accepts and retains water-basedink. For example, the fabric material may be formed of cotton, rayon,wool, or linen. In other embodiments, the fabric material may be asynthetic material, e.g., polyester, coated with a hydrophilic polymerable to receive and retain ink. The ink may be, for example, anywater-based ink found in ball-point pens, markers, fabric markers,permanent markers, ink-jet printers, and/or gel pens. The fabricmaterial may be configured to accept iron-on decals and/or fabricstickers.

Card 200 may be configured to permit, enable, or enhance datatransmission functions of electronic component 206. For example, in someembodiments, aperture 222 may be provided on or in fabric component 208to permit, enable, and/or enhance transmission functions of electroniccomponent 216. Aperture 222 may be configured to allow electroniccomponent 206 to transmit information through physical contact, opticalrecognition, radiofrequency communication, or other mechanisms. In otherembodiments, aperture 222 may also or alternatively be provided on or insubstrate 202. Aperture 222 may be formed using a laser-cutting process,stamping process, or another suitable process.

FIG. 3A shows a front view of card 200 from first side 220. Secondfabric surface 216 may be visible from first side 220. In someembodiments, an aperture 222 may be formed in fabric component 208 andmay be configured to provide access to or enable functionality of anelectronic component 206 (e.g., an EMV chip). Fabric surface 216 mayreceive ink 328 applied by a user of card 200 to personalize orcustomize card 200. During manufacturing, fabric surface 216 may beblank or may include a logo or design printed on fabric surface 216. Auser may personalize fabric surface 216 in any design or pattern, or mayapply any hand-written text or signature. In some embodiments, the usermay print any desired design on the fabric surface 216.

In some embodiments, a signature or other markings on first fabricsurface 216, visible from side 220 of card 200, may be used toauthenticate the user or to provide validation of the user's signature.For example, the user may configure a mobile application or financialaccount, via a device having a camera, to recognize the card 200 basedon the unique markings added by the user.

FIG. 3B shows a rear view of card 200 from second side 214. As shown,substrate surface 210 may include visible information 324. Visibleinformation 324 may include, for example, personal information, such asinformation that is associated with a card, a user of the card, orinformation relating to an account associated with the card or carduser. In some embodiments, visible information 324 may include“transaction information,” such as financial information (e.g., cardnumbers, account numbers, expiration dates etc.), individual-identifyinginformation (e.g., name, address, signature, etc.), bank information,and/or transaction network information, logos, designs, graphics, and/orother information.

In some embodiments, visible information 324 may be formed into secondsubstrate surface 210. That is, for example, visible information 324 maybe stamped (i.e., through the formation of one or more mechanicalindents), printed, etched, milled, laser-cut, embossed, embroidered,stitched, woven, etc., into or onto second substrate surface 210.

In some embodiments a magnetic strip 326 may be disposed on oraccessible from (i.e., readable from) second substrate surface 210. Inother embodiments, an aperture (not shown) may be disposed on secondsubstrate surface 210 and configured to provide access to or enablefunctionality of a data storage component. In other embodiments, one ormore data storage components may be disposed within card 200 (e.g., in acavity between substrate 202 and fabric component 208) and configured toperform data transmission functions through the material of substrate202 and/or fabric component 208 without an aperture.

FIGS. 4A-4C show an exemplary embodiment of card 200 having anelectronic component 206, e.g., a microchip. FIG. 4A shows a front viewof card 200 from first side 220. As shown, fabric component 208 mayinclude aperture 222. Electronic component 206 may be accessible (i.e.,able to participate in data transfer) via aperture 222. As shown in FIG.4B, a second data storage component, such as a magnetic strip 326, maybe disposed on substrate 202 and visible from second side 214 of card200.

FIG. 4C depicts a cross-sectional view of card 200 of FIGS. 4A and 4Balong line 4C-4C. As shown in FIG. 4C, aperture 222 may partially definespace 430. Space 430 may be a void space within card 200 or itscomponents (e.g., within one or more of substrate 202 and fabric layer208). Space 430 may be configured to house or contain electroniccomponent 206. In the embodiment of FIG. 4C, space 430 may extend fromfirst fabric surface 216 to below first substrate surface 212, but notto second substrate surface 210. That is, space 430 may extend throughfabric component 208 and partially through substrate 202. In otherembodiments, space 430 may extend fully or only partially through fabriccomponent 208, but not into substrate 202.

As also shown in FIG. 4C, substrate 202 and fabric component 208 may bejoined via second fabric surface 218 and first substrate surface 212.First fabric surface 216 may face outward (with respect to card 200) andaway from first and second substrate surfaces 212, 210. That is, firstfabric surface 216 may face and be visible from first side 220 of card200. Second fabric surface 218 may face inward (with respect to card200) and toward first and second substrate surfaces 212, 210. Firstsubstrate surface 212 may face inward (with respect to card 200) andtoward first and second fabric surfaces 216, 218. Second substratesurface 210 may face outward (with respect to card 200) and away fromfirst and second fabric surfaces 216, 218. That is, second substratesurface 210 may face and be visible from second side 214 of card 200.

As used herein, the term “forming,” when used to describe methods,processes, or steps of forming components or features of transactioncards, may encompass acts of constructing components from constituent orstock materials. The term “forming” may also encompass acts of“providing” components that have already been constructed fromconstituent or stock materials.

FIG. 5 shows an exemplary method/process 500 of forming a transactioncard 200 having a writeable surface consistent with disclosedembodiments. Process 500 may include forming a substrate componenthaving a first substrate surface opposite a second substrate surface(Step 510). FIG. 6A illustrates an example of step 510 in which fabriccomponent 208 and substrate component 202 may be formed separately(i.e., as distinct components via separate, respective processes).Substrate 202 may be formed during step 510, for example, by a moldingprocess (e.g., injection molding, compression molding, etc.), millingprocess, stamping process, sheet forming process, or combinationsthereof. For example, substrate 202 may be formed by laminating aplurality of polyvinyl chloride sheets to form a rigid structure.

Process 500 may also include forming a fabric component having a firstfabric surface opposite a second fabric surface (Step 520). Fabriccomponent 208 may be formed during step 520, shown in FIG. 6A. Forexample, forming fabric component 208 may include weaving, knitting, orbinding fibers of desired material, or by cutting or otherwiseseparating a portion of fabric material from a roll or sheet of stockmaterial. In some embodiments, fabric component 208 may be formed from acanvas material using any of the previously described techniques.

Aperture 222 may be formed in fabric component 208 by laser cutting,punching, trimming, or another method. Aperture 222 may be formed suchthat electronic component 206 is accessible through fabric component 208and readable by one or more devices to transmit data.

Process 500 may also include applying an adhesive material to the secondfabric surface 218 of fabric component 208 (Step 530). FIG. 6Billustrates an example of step 530 in which an adhesive material 204 isdisposed on second fabric surface 218. Adhesive material 204 may besprayed, brushed, or otherwise applied to second fabric surface 218 by,for example, spray deposition, sputter deposition, lamination, or othertechnique known to one of skill in the art. In some embodiments,adhesive material 204 may be applied to substrate 202 or to bothsubstrate 202 and fabric component 208.

Process 500 may also include joining the substrate component and thefabric component via the second fabric surface and the first substratesurface (Step 540). With reference to FIGS. 6B and 6C, substrate 202 andfabric component 208, including adhesive 204, may be brought togetherduring step 540 such that second fabric surface 218 faces and/orcontacts first substrate surface 212. First fabric surface 216 andsecond substrate surface 210 may face away from each other (i.e., inopposite directions), and may each face away from each of second fabricsurface 218 and first substrate surface 212. In some embodiments,substrate 202 and fabric component 208 may by joined usinginterconnecting features, fasteners, and/or another types of joiningtechnique or mechanism.

Process 500 may also include affixing an electronic component 206 tofirst substrate surface 212 (step 550). With reference to FIG. 6D,electronic component 206 may be disposed in the space 430 defined byaperture 222. In some embodiments, electronic component 206 may beaffixed to first substrate surface 212 by an adhesive 632. Adhesive 632may be the same as adhesive material 204, or may be a different adhesivematerial. In some embodiments, adhesive 632 may be a thermoplasticmaterial, e.g., polyvinyl chloride.

In addition to the steps described above, process 500 may also includedisposing visible information on the second substrate surface. Visibleinformation may include, for example, personal information, such asinformation that is associated with a card, a user of the card, orinformation relating to an account associated with the card or carduser. In some embodiments, visible information may include “transactioninformation,” such as financial information (e.g., card numbers, accountnumbers, expiration dates etc.), individual-identifying information(e.g., name, address, signature, etc.), bank information, and/ortransaction network information, holographic images, logos, designs,graphics, and/or other information. Visible information may be disposedon second substrate surface 210. In some embodiments, visibleinformation may be formed into second substrate surface 210. That is,for example, visible information may be stamped, printed, etched,milled, laser-cut, embossed, etc., into or onto second substrate surface210. In some embodiments, visible information may include raisedalphanumeric characters, e.g., account number or account holder name.

In some embodiments, process 500 may further include a step 552 offorming an outer layer on substrate 202. For example, as shown in FIG.6E, a transparent layer 634 may be disposed on second substrate surface210 by dipping card 200 in a coating material or laminating atransparent material on surface 210. Layer 634 may improve or enhancethe mechanical properties of substrate 202 and/or protect the visibleinformation on second substrate surface 210.

Process 500 may also further include a step 554 of forming an outerlayer on surface 216 of the fabric material 208. For example, a coatingmaterial may be disposed on first fabric surface 216, to protect firstfabric surface 216 from the elements. In such an example, coatingmaterial may be applied to first fabric surface 216 to providewater-repellant, water-resistant, and/or oleophobic (i.e., stainresistant).

While illustrative embodiments have been described herein, the scopeincludes any and all embodiments having equivalent elements,modifications, omissions, combinations (e.g., of aspects across variousembodiments), adaptations or alterations based on the presentdisclosure. The elements in the claims are to be interpreted broadlybased on the language employed in the claims and not limited to examplesdescribed in the present specification or during the prosecution of theapplication, which examples are to be construed as non-exclusive. It isintended, therefore, that the specification and examples be consideredas example only, with a true scope and spirit being indicated by thefollowing claims and their full scope of equivalents.

What is claimed is:
 1. A transaction card, comprising: a substratecomponent having a first substrate surface opposite a second substratesurface; a fabric component having a first fabric surface opposite asecond fabric surface, the fabric and substrate components being joinedalong the second fabric surface and the first substrate surface, thefabric component defining an aperture and the first fabric surface beingan outermost writeable surface of the transaction card; and anelectronic component disposed in the aperture, the electronic componentand substrate being joined along a first electronic component surfaceand the first substrate surface.
 2. The transaction card of claim 1,wherein a length and a width of the substrate component are the same asa length and a width of the fabric component, respectively.
 3. Thetransaction card of claim 1, wherein the substrate component comprises amaterial of at least one of fiberglass, metal, or plastic.
 4. Thetransaction card of claim 1, wherein the fabric component comprises awoven material.
 5. The transaction card of claim 4, wherein the wovenmaterial comprises a canvas material.
 6. The transaction card of claim4, wherein the woven material comprises a writeable material.
 7. Thetransaction card of claim 1, wherein the electronic component comprisesat least one of a microprocessor, a radiofrequency identifier, or an EMVchip.
 8. The transaction card of claim 1, further comprising an adhesivelayer disposed between the first substrate surface and second fabricsurface.
 9. The transaction card of claim 1, wherein the electroniccomponent is joined to the first substrate surface with a thermoplasticmaterial.
 10. The transaction card of claim 9, wherein the thermoplasticmaterial comprises polyvinyl chloride.
 11. The transaction card of claim1, further comprising an outer layer disposed on the second substratesurface.
 12. The transaction card of claim 11, wherein the outer layercomprises a protective coating material disposed on the second substratesurface.
 13. The transaction card of claim 1, wherein the outer layercomprises a laminate layer disposed on the second substrate surface. 14.The transaction card of claim 13, wherein the laminate layer furthercomprises a holographic image.
 15. The transaction card of claim 1,further comprising visible information disposed on the second substratesurface.
 16. The transaction card of claim 15, wherein visibleinformation comprises raised alphanumeric characters.
 17. Thetransaction card of claim 15, wherein the visible information comprisesprinted information.
 18. The transaction card of claim 1, furthercomprising a magnetic strip disposed on the second substrate surface.19. The transaction card of claim 18, wherein the magnetic strip isjoined to the second substrate surface with a thermoplastic material.20. The transaction card of claim 1, further comprising an antennadisposed between the first substrate surface and the second fabricsurface.